Save. Share. Connect.
Saturday, December 3, 2016
VOLUME - NUMBER
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Feature: Test and Measurement
Product Preview: EDS
May 2008 Issue
Electronic Mfg. Products
Add Message Board
Asymtek Intros Microelectronics Dispensing Solutions
Scalable dispensing platform.
Carlsbad, CA — Asymtek, a Nordson company, is introducing the Spectrum S-920N Series of scalable dispensing platforms that adapt to the needs and requirements of high-volume microelectronics manufacturing and printed circuit board assembly such as flip chip and CSP underfill. The scalable machine design matches current and future process requirements for maximum return on investment.
According to the company, the new dispensing platform incorporates technologically advanced and integrated software and hardware control for increased throughput, accuracy and productivity. The new Rapid Response Heater
system minimizes startup time by ensuring quick ramp to set point, while delivering uniform heat across the entire part surface with its innovative low-mass design. Controlled Process Heat (CpH
) can be added for an even higher level of automated heat control. This translates to higher yield, reduced preheat time and improved "thermal footprint efficiency" by requiring less power.
Programmable fluid and valve pressure provide closed-loop processing, eliminating the need for manual adjustment, and patented Mass Flow Control (MFC) and Calibrated Process Jetting (CpJ
) add automatic fluid weight measurement and adjustment. The Spectrum's digital vision system provides high-speed fiducial image acquisition.
The Spectrum S-920N Series can be configured with single or dual lanes, and one, two or three heat stations depending on capacity, process control, application, and footprint requirements. As process needs change, the platform can be upgraded in the field and configured to meet specific dispensing requirements, from simple dots of silver epoxy or solder paste to underfilling flip chips with extremely tight keep-out zones. The dual-lane configuration is especially suitable for applications with long preheat cycles or long flow-out times. Dispensing can be done in one lane while parts in the second lane reach temperature set point or flow-out occurs. The system footprint is 600 x 1321mm (23.6 x 52.0-in.) with a single heat station, 850 x 1321mm (33.5 x 52.0-in.) for two heat stations, and 1100 x 1321mm (43.3 x 52.0-in.) for three heat stations. This slim design maximizes floor space utilization and lowers cost of ownership.
Contact: Asymtek, 2762 Loker Ave. W., Carlsbad, CA 92008
800-279-6835 or 760-431-1919 fax: 760-431-2678 E-mail: firstname.lastname@example.org Web:
© 2015 USTECH. All Rights Reserved. |
Contact Us: 610-783-6100 | email@example.com
powered by GIM