Thursday, June 21, 2018
Publication Date: 03/1/2008
Archive >  March 2008 Issue >  Product Preview: APEX > 

Ascentech Intros Solder Paste Analyzer
Solder paste analyzer.
Chester, CT — Ascentech, LLC, North American distributor for the GEN3 Systems Ltd. products, is introducing new solderability test equipment. The premier new product is the ShareGen SPA 1000 Solderpaste Analyzer, which provides fast and accurate testing to help control and manage solder paste in the production process. It helps reduce a range of defects including missing components, tombstoning, component misalignment, and non-wetting.

Use of the analyzer reportedly greatly reduces inspection and rework time and cost, thereby increasing profit. The new unit is an unusual 6-in-1 solder paste test system that can perform up to six separate tests that would previously have been performed by separate instruments, in accordance to IEC 61189-5 and IPC-TM-650 standards. It is an "All-in-One" test system that can also be used to conduct solder paste "Open Time" testing.

Also on display is the MUST III Solderability Tester, a wetting balance testing system capable of testing to all relevant solder standards including ICE, MIL-STD, IPO/EYE/JADE, etc. The system measures the solderability of a printed circuit board and/or component's metallic terminations by documenting the wetting curve of the unit under test. It is appropriate for testing all devices including multi-leaded components as well as SMT and BGA devices.

For more information, contact: Ascentech, 127 Goose Hill Rd., Chester, CT 06412 860-526-8903 E-mail: Web: or

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