Save. Share. Connect.
Saturday, August 27, 2016
VOLUME -23 NUMBER 3
Publication Date: 03/1/2008
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Feature: PCB and Assembly
Product Preview: APEX
March 2008 Issue
Product Preview: APEX
Add Message Board
Amtech Intros Hi-Performance Solder Paste
Lead-free solder paste.
Branford, CT — Amtech Solder Products, Inc. has developed NC 560-LF, a no-clean, lead-free solder paste designed specifically to improve solder joint reliability and printing characteristics with all Pb-Free PC board metallization. The new solder paste reportedly delivers excellent lot-to-lot and stencil printing consistency, along with superior print performance characteristics.
According to the company, the solder paste provides excellent wetting and good surface tension, virtually eliminating aperture clogging for up to 20 prints. There is minimal residue, and the paste provides thermal stability at high temperatures — up to 300°C. The paste's viscosity is 650 to 850 Kcps +10 percent, has wider process windows with long stencil life, and initial tack value of 33g force.
The new paste complies with RoHS directive 2002/95/EC for lead-free, meets the highest IPC 7095 voiding performance classification of Class 111.
Use of the new lead-free solder paste reportedly results in higher quality solder joints and higher processing speeds due to its superior wetting, strong activity, extended shelf life, excellent viscosity, grain size, and particle sphericity even at higher melting temperatures. This innovative solder paste is low beading and low voiding, which reduces scrap and rework. It leaves a post reflow residue that is non-conductive, non-corrosive, and serves as a protective coating that can easily be removed with Kyzen
The new solder paste represents further refinement of the company's successful SynTECH and SynTECH-LF solder pastes. NC-560-LF solder paste incorporates new solvent packages that are resistant to drying out on the stencil regardless of process parameters. Furthermore, its activation properties have been designed specifically for gold finished boards and all lead-free metallization.
For more information, contact: Amtech Solder Products, Inc., 75 School Ground Road, Branford, CT 06405
800-435-0317 or 203-481 0362 fax: 203-481-5033 Web:
See at APEX Booth #1824.
© 2015 USTECH. All Rights Reserved. |
Contact Us: 610-783-6100 | firstname.lastname@example.org
powered by GIM