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Search :      Thursday, January 08, 2009


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Henkel Intros Dispensable Thermal Interface
Dispensable thermal interface.
Irvine, CA — Henkel has launched its latest thermal product, PowerstrateXtreme™ Dispensable (PSX-D). As a paste medium, the company's PSX-D alleviates the challenges associated with phase change films and the shortcomings of thermal greases by

incorporating phase change performance into a liquid product, allowing for superior thickness control and considerable manufacturing flexibility while delivering process adaptability — needle dispensed or manually applied onto a heat sink or other surfaces.

According to the company, the new interface material eliminating the need for additional equipment investment and improving throughput. The material has been optimized as a TIM2 material for use between microprocessors, IGBT, FBDIMM/Memory, GPU, multichip modules, ASICs and their active heat sinks.

The material is also re-workable and repeatable making it especially cost-effective for both lidded and bare die processor applications.
For more information, contact: Henkel Corp.,15350 Barranca Pkwy., Irvine, CA 92618 949-789-2500 fax: 949-785-2595 Web: http://www.henkel.com

See at APEX Booth #634.

 
 

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