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Publication Date: 03/1/2008
Archive >  March 2008 Issue >  Product Preview: APEX > 

Endicott Intros HPC-Z Interconnect Solution
PCB cross-sections using HPC-Z.
Endicott, NY — Having to drill plated-thru-holes (PTHs) to make signal connections within PC boards may become a thing of the past, thanks to a new technology from Endicott Interconnect Technologies. New HPC-Z interconnections provide signal connections only where desired, with functional isolation for single or double side surface mount partitions.

The HPC-Z interconnect solves thick board drilling and wire density problems, and meets the need for functional isolation, with the capability of isolating high-speed channels on one sub-assembly and low-speed channels on another. It provides interconnections within the board, and eliminates unnecessary PTH drilling.

According to the company, it is only necessary to drill the length of the sub-composite. This can eliminate PTHs that are blocking other wiring channels, which increases wireability, eliminates PTH stubs and results in a thinner and faster board.

HPC-Z provides a "PTH-like" connection at lamination with a pad-to pad connection made with conductive epoxy. Since there is vertical connection with a lamination instead of a PTH, aspect ratios for drill and plate are limited to sub-assembly dimensions. Drilling is reduced; instead of having to drill a 300-mil-thick board through the entire structure to go from signal plane to signal plane, now it is only necessary to drill where needed.

For example, instead of having to drill 3 PTHs all the way though the board with a 10 mil drill for each of 3 sub-assemblies, it is now possible to have 3 PTHs on one, 2 PTHs, on another, and 1 PTH on the other — whatever is needed and no more than are needed. This minimizing of the PTH effect results in increased wiring density due to smaller vias and lands. With HPC-Z, there are more wiring lines available — lines that would have been closed off by PTH drilling.

For more information, contact: Endicott Interconnect Technologies, Inc. 1093 Clark Street, Endicott, NY 13760 866-820-4820; fax: 607-755-7000 Web:

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