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Thursday, April 26, 2018
VOLUME -23 NUMBER 3
Publication Date: 03/1/2008
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Electronic Mfg. Services
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Special Feature: PCB and Assembly
Product Preview: APEX
March 2008 Issue
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Besi Restructures and Merges Laurier into Datacon
Londonderry, NH — Laurier Inc., a division of BE
Semiconductor Industries (Besi) and manufacturers of die handling equipment, is now fully integrated into Datacon Technology GmbH die bonding equipment division. The reorganization consolidates Laurier into Datacon, resulting in a single die handling division. Part of the consolidation, Datacon has phased out the Laurier CDB50 Series High Accuracy Flip Chip Bonder and the Laurier DS4500 Series Die Sorters.
Laurier Sales and Customer Support will be fully integrated into Besi's worldwide Sales and Service network. Local Besi Sales and Service offices will continue to provide support and spare parts to Laurier customers. The Laurier application/engineering team will remain at the New Hampshire facility supporting customers with timely solutions to vision, software, and process challenges.
For more information, contact: Datacon, 10 Tinker Ave., Londonderry, NH 03053
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