Thursday, May 25, 2017
VOLUME -23 NUMBER 3
Publication Date: 03/1/2008
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Archive >  March 2008 Issue >  Front Page News > 
Schott Solar Building New Plant in Albuquerque

Santa Fe, NM — Schott AG of Mainz, Germany (Schott) is invading the U.S. big time with a new solar power generator manufacturing plant being built in New Mexico. Schott Solar, Inc. a wholly owned subsidiary of Schott AG, will construct a new solar energy technology production facility in the Mesa del Sol region of Albuquerque, NM....
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HDI: Our Newest "Old" Technology


Bannockburn, IL — Miniaturization, increased reliability, better connectivity — those are just a few advantages of high density interconnect (HDI) with microvias, when compared with plated-through hole technology. The downside: for many OEMs, it's too costly to include in systems. "And that ...Read More
Organic Electronics Materials: New Revenues, New Challenges

Glen Allen, VA — Organic electronics materials are poised on the brink of an enormous upsurge in worldwide applications, according to a new report. NanoMarkets has recently published a report on organic materials and according to its latest numbers this little niche business will exceed $1.0 billion ...Read More
NEPCON Shanghai: SMT & Test Equipment

The vibrant NEPCON show in Shanghai early this April, has exhibitors from all around the world with their latest SMT equipment. Other exhibitors introduced test machines and assembly equipment, as well as various services supporting the electronics production segment. US Tech was among the hi-tech publications which supported this event in China.  Read More


 
 
Ventec: Thomas Michels to Speak at the EIPC Summer Conference
SUZHOU, CHINA - Ventec's European Managing Director Thomas Michels will speak at EIPC Summer Conference on June 1st & 2nd, 2017 to be held at the Best Western Plus Manor Hotel, Solihull, UK.

Indium Corporation’s Mackie to Present at IMAPS ATW on Advances in Semiconductor Packaging
CLINTON, NY - Indium Corporation’s Andy C. Mackie, PhD, MSc, Senior Product Manager for Semiconductor and Advanced Assembly Materials, will present at the IMAPS Advanced Technology Workshop and Tabletop Exhibition on Advances in Semiconductor Packaging on June 15 at Binghamton University in Vestal, N.Y.

Dr. Mike Bixenman Discusses Non-Standard Test Methods at ICSR
NASHVILLE, TN - KYZEN is pleased to announce that Mike Bixenman, DBA will present at the International Conference on Soldering & Reliability (ICSR) held in conjunction with the Toronto SMTA Expo & Tech Forum.
 

 
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