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Search :      Thursday, January 08, 2009


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Tabletop Reflow Simulator from Malcomtech
Hayward, CA — Malcomtech is introducing a new tabletop reflow simulator that can take video to analyze curving and warping of electronic parts and boards due to thermal stress — using actual reflow conditions, during components wetting process in the reflow oven. The system simulates the temperature profile of the reflow oven, and measures the warpage of a sample part or board at different heats/times.

A laser beam on the underside measures the displacement in both X and Y directions. The local matrix control system of the hot air heater makes it possible to fine-tune the heating chamber for optimum performance. The unit will accurately simulate the reflow process using 3 built-in heaters, allowing the user to observe the state of soldering through windows in the front, side, and top. It also makes it possible to observe and record the melting state of the solder paste being used.

For more information, contact: Malcomtech International, 26200 Industrial Blvd., Hayward, CA 94545. 510-293-0580; fax: 510-293-0940. E-mail: info@malcomtech.com Web: http://www.malcomtech.com

See at APEX Booth #336.

 
 

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