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Search :      Friday, November 21, 2008


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Dage: X-ray Inspection with 2.0 MegaPixel Imaging
Digital x-ray inspection system.
Fremont, CA — Dage Precision Industries has equipped its XiDAT XD7600NT digital x-ray inspection system with a standard 2.0 mega pixel imaging system.

According to the company, the system's innovative look and manipulator design provides oblique angle viewing of up to 70° for any position, 360° around any point of the entire 18 x 16-in. (458 x 407mm) inspection area. This allows the instrument to inspect all interconnections and PC boards containing BGA and CSP devices. The XD7600NT comes standard with the Dage NT250 x-ray tube with 250 nanometers sub-micron feature recognition and real-time digital inspection at 2.0 mega pixel viewed on a 24-in. flat panel LCD display with up to 9,200X magnification.

The x-ray inspection system can be equipped with a computerized tomography (CT) option providing 3D modeling and volumetric measurement of solder joints. It can be easily converted between 2D and 3D modes making it a common platform for analytical analysis of solder interconnections for critical applications such as stacked die, MEMS, package-in-package and package-on-package.

For more information, contact: Dage Precision Industries, Inc., 48065 Fremont Blvd., Fremont, CA 94538-6541 510-683-3930 Web: http://www.dage-group.com

See at APEX Booth #1632.

 
 
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