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Tuesday, February 20, 2018
VOLUME -23 NUMBER 2
Publication Date: 02/1/2008
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Feature: Components and Distribution
Product Preview: APEX
February 2008 Issue
Product Preview: APEX
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Asymtek Intros Scalable Dispensing System
Scalable dispensing system.
Carlsbad, CA — Asymtek, a Nordson company, is introducing the Spectrum S-920N Series of scalable dispensing platforms that adapt to the needs and requirements of high-volume microelectronics manufacturing and printed circuit board assembly such as flip chip and CSP underfill. The scalable machine design matches current and future process requirements for maximum return on investment. The new dispensing platforms use technologically advanced and integrated software and hardware control for increased throughput, accuracy and productivity. The new Rapid Response Heater
system minimizes startup time by ensuring quick ramp to set point and delivers uniform heat across the entire part surface with its innovative low-mass design, while Controlled Process Heat (CpH
) can be added for an even higher level of automated heat control. This can produce higher yield, reduced preheat time and improved "thermal footprint efficiency" by requiring less power. Programmable fluid and valve pressure provide closed-loop processing, eliminating the need for manual adjustment, and patented Mass Flow Control (MFC) and Calibrated Process Jetting (CpJ
) add automatic fluid weight measurement and adjustment. The Spectrum?s digital vision system provides high-speed fiducial image acquisition.
The system can be configured with single or dual lanes, and one, two or three heat stations depending on capacity, process control, application, and footprint requirements. As process needs change, the platform can be upgraded in the field and configured to meet specific dispensing requirements, from simple dots of silver epoxy or solder paste to underfilling flip chips with extremely tight keep-out zones. The dual-lane configuration is especially suited for applications with long preheat cycles or long flow-out times. Dispensing can be done in one lane while parts in the second lane reach temperature set point or flow-out occurs.
The system uses the company's patented non-contact jetting technology for applications such as stacked die underfill, chip scale package (CSP) underfill, and UV gaskets for liquid crystal displays (LCDs). Dispensing into narrow 200µ gaps between components, shields, or into slots can be difficult or impossible with needle dispensing because the needle might not fit, can clip and damage the die, or require needle calibration to compensate for bent needles. The jetting process overcomes these limitations while offering high-speed dispensing with flow rates up to 500 mg/second and shot rates up to 200 dots/second.
The system footprint is 600 x 1321mm (23.6 x 52.0-in.) with a single heat station, 850 x 1321mm (33.5 x 52.0-in.) for two heat stations, and 1100 x 1321mm (43.3 x 52.0-in.) for three heat stations. This slim design maximizes floor space utilization and lowers cost of ownership.
For more information, contact: Asymtek, 2762 Loker Ave. W., Carlsbad, CA 92008
800-279-6835 or 760-431-1919 fax: 760-431-2678 E-mail: firstname.lastname@example.org Web:
See at APEX Booth #511.
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