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Tuesday, December 6, 2016
VOLUME -23 NUMBER 2
Publication Date: 02/1/2008
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February 2008 Issue
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Lead-Free Electronics Reliability
Bannockburn, IL — With lead-free processes now implemented, rework, repair and reliability bring their own significant challenges. On March 11-12, 2008, IPC and JEDEC (Joint Electron Device Engineering Council) will host an international conference on lead-free electronics reliability, rework and repair in Raleigh, NC. The conference will cover the issues manufacturers face as a result of implementing lead-free processes including alloy choices, compatibility and solder concerns.
Highlights of the conference on March 11 include topics such as: the impact of assembly rework and repair on the reliability of PCB interconnect structures, backward compatibility, lead-free rework in a mixed-alloy environment, lead-free acceptability requirements for electronic assemblies, case studies and more.
Industry experts from around the globe will address a host of issues during the educational program on March 12 including lead-free solder joint reliability, interconnect failure and design for plated-through holes/vias and reliability concerns with lead-free soldering processes.
For more information, contact: IPC
847-509-9700 fax: 847-509-9798 Web:
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