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Saturday, December 3, 2016
VOLUME -23 NUMBER 2
Publication Date: 02/1/2008
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Feature: Components and Distribution
Product Preview: APEX
February 2008 Issue
Front Page News
Innovations Reap Huge Savings for Semiconductors
Gaithersburg, MD — A new report from the National Institute of Standards and Technology (NIST) shows that investment in measurement science has and will continue to have a dramatic effect on innovation, productivity, growth and competitiveness in and among high technology sectors. The report, "Economic
Impact of Measurement...
MEMS Heart of New Military Ordnance
By John Toon, Georgia Institute of Technology, Atlanta, GA
Atlanta, GA — MEMS technology is playing an important role in developing tomorrow's military ordnance. Tiny copper structures with pores at both the nanometer and micron size scales could play a key role in the next generation of detonators used to improve the reliability, reduce the size and lower ...
Importers Share Responsibility for Unsafe Products
Milwaukee, WI — Tainted pet food. Lead paint on toys. While Chinese product recalls have dominated recent headlines, much of the responsibility for these quality problems lies with inadequate oversight by U.S. importers, say product experts in the latest quarterly report
Murphy, Choh and Pilla Join ClassOne Technology's Board of Advisors
KALISPELL, MT - ClassOne Technology (
), manufacturer of advanced wet processing equipment for ≤200mm substrates announced the formation of a Board of Advisors. This body will be made up of highly-regarded senior executives from the semiconductor industry who will provide their perspective and guidance to ClassOne as it navigates the expansion of its operations.
Indium Corporation’s Karch Recognized for Best Presentation at IMAPS Autumn Conference 2016
CLINTON, NY - Indium Corporation’s
, Regional Technical Manager for Germany, Austria and Switzerland, was recognized for his technical presentation at the IMAPS Autumn Conference in October in Munich, Germany.
Karch was awarded “Best Presentation” for the session New Solder Material Technology in the Manufacturing Process of IGBT Modules, which discussed a new method that produces strong, reliable solder joints that resist cracking and thermal fatigue.
Ventec International Group Focus On High Thermal Performance Materials for Automotive and LED Applications at HKPCA 2016, China
SUZHOU, CHINA - Ventec International Group, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, will exhibit in
, scheduled to take place
December 7th-9th, 2016
Shenzhen Convention & Exhibition Center, China
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