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Wednesday, May 24, 2017
VOLUME -23 NUMBER 2
Publication Date: 02/1/2008
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Feature: Components and Distribution
Product Preview: APEX
February 2008 Issue
Front Page News
Innovations Reap Huge Savings for Semiconductors
Gaithersburg, MD — A new report from the National Institute of Standards and Technology (NIST) shows that investment in measurement science has and will continue to have a dramatic effect on innovation, productivity, growth and competitiveness in and among high technology sectors. The report, "Economic
Impact of Measurement...
MEMS Heart of New Military Ordnance
By John Toon, Georgia Institute of Technology, Atlanta, GA
Atlanta, GA — MEMS technology is playing an important role in developing tomorrow's military ordnance. Tiny copper structures with pores at both the nanometer and micron size scales could play a key role in the next generation of detonators used to improve the reliability, reduce the size and lower ...
Importers Share Responsibility for Unsafe Products
Milwaukee, WI — Tainted pet food. Lead paint on toys. While Chinese product recalls have dominated recent headlines, much of the responsibility for these quality problems lies with inadequate oversight by U.S. importers, say product experts in the latest quarterly report
Ventec: Thomas Michels to Speak at the EIPC Summer Conference
SUZHOU, CHINA - Ventec's European Managing Director Thomas Michels will speak at EIPC Summer Conference on June 1st & 2nd, 2017 to be held at the Best Western Plus Manor Hotel, Solihull, UK.
Indium Corporation’s Mackie to Present at IMAPS ATW on Advances in Semiconductor Packaging
CLINTON, NY - Indium Corporation’s
Andy C. Mackie, PhD, MSc
, Senior Product Manager for Semiconductor and Advanced Assembly Materials, will present at the
IMAPS Advanced Technology Workshop and Tabletop Exhibition on Advances in Semiconductor Packaging
on June 15 at Binghamton University in Vestal, N.Y.
Dr. Mike Bixenman Discusses Non-Standard Test Methods at ICSR
NASHVILLE, TN - KYZEN is pleased to announce that Mike Bixenman, DBA will present at the International Conference on Soldering & Reliability (ICSR) held in conjunction with the Toronto SMTA Expo & Tech Forum.
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