Save. Share. Connect.
Sunday, June 26, 2016
VOLUME -22 NUMBER 12
Publication Date: 12/1/2007
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Feature: Test and Measurement
Product Preview: Electronics West / MDM
December 2007 Issue
Add Message Board
Henkel Opens Electronics Mold Compound Facility in China
Irvine, CA — Henkel Huawei Electronics Co. Ltd., a joint venture of Huawei Electronics and Henkel Corporation, has unveiled its new state-of-the-art mold compound manufacturing facility in Lianyungang, China. The company's continued growth has necessitated additional manufacturing lines to support its global customer base. The new operation encompasses 16,000m
of administrative and manufacturing space and have a total production capacity of 25,000 tons of material annually.
With production of more than ten patented epoxy mold compound formulations, Henkel Huawei's Lianyungag site will not only be the central manufacturing hub, but will also deliver R&D capabilities for new product development, material prototype production, test and analysis and ongoing future technologies research. The mold compound materials are currently incorporated into a variety of devices, from mainstream to leading-edge, including: discrete components, SOICs, QFPs, BGAs, CSPs and POPs. The company supports numerous semiconductor firms globally, a customer list that includes the world's top packaging companies.
For more information, contact: Henkel Corporation, 15350 Barranca Parkway, Irvine, CA 92618
© 2015 USTECH. All Rights Reserved. |
Contact Us: 610-783-6100 | email@example.com
powered by GIM