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Wednesday, January 07, 2009
December 2007 Issue
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Ironwood Intros Shinko BGA ZIF Socket
BGA ZIF socket.
Burnsville, MN — Ironwood Electronics has introduced the high performance BGA ZIF socket for 0.4mm pitch BGA. The SG-BGA-7096 socket is designed for a Shinko 12mm package size; operates at bandwidths up to 10GHz with less than 1dB of insertion loss. The sockets are designed to dissipate up to several watts without extra heat sinking and can handle up to 100 watts with custom heat sink. The contact resistance is typically 23 milliohms per pin. The socket requires only space on the board for the two mounting screw areas and 2.5mm clearance around the chip so discrete components can be placed near the IC.
The socket is constructed with high-performance and low inductance elastomer. The temperature range is -35° to +100°C. The pin inductance is 10.15nH, and capacitance to ground is 0.10pF. The socket accommodates 12mm BGA body size IC packages with 28 X 28 array and 515 balls. The socket is simply attached to the PC board with two screws; the chip dropped in; lid attached, and compression screw tightened.
For more information, contact: Ironwood Electronics, Inc., 11351 Rupp Dr.,Suite 400, Burnsville, MN 55337
800-404-0204 or 952-229-8200 fax: 651-452-8400 E-mail: info@ironwoodelectronics.com Web:
http://www.ironwoodelectronics.com
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