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Cobar Intros Low-Void Solder Paste
Low-voiding lead-free solder paste.
Breda, Netherlands — Non-voiding solder joints do not exist, according to a statement issued by Cobar Europe BV. Voiding is an integral part of the behavior of molten metal during solidification. According to the company, if absolutely zero voids in solder joints are impossible, then the next best thing is very small ones, and the smaller the better.

The company has introduced its new SAC-XM5S SAC3 Low Voiding Lead-Free Solder Paste and has issued its SAC3 "Cobar Challenge". With this special flux formulation, it is reportedly possible to control the size of the voids to keep them within acceptable limits. The company's new lead-free solder paste is a dedicated low-voiding product. At the same time, it offers superior reflow and printing properties.

For more information, contact: Cobar Solder Products, 53 Wentworth Avenue, Londonderry, NH 03053 603-432-7500 fax: 603-432-7519 Web: http://www.cobar.com
 
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