Monday, October 23, 2017
VOLUME -22 NUMBER 12
Publication Date: 12/1/2007
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Archive >  December 2007 Issue >  Front Page News > 
Green Trucks Help with Holiday Rush


Santa Rosa, CA — It's a funny-looking car, some would say it's "cute" while to others it's simply "weird" but everybody has some kind of opinion about this very green all-electric three-wheeler that is starting to make serious inroads in America's urban areas. The electric is known as the...
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Cancer Destroyed by Radio Waves & Nanotubes

Houston, TX — Carbon nanotubes and RF energy are the latest front runners in the search for cancer cures. In a totally unexpected development, it was found that cancer cells treated with carbon nanotubes can be destroyed by non-invasive radio waves that heat up the nanotubes while sparing untreated tissue. ...Read More
Printed Electronics and the Future of Mobile Phones


Cambridge, MA — Printed electronics is a term that covers printed and potentially printed electronics in a number of categories. It is the basis of an emerging $300 billion business embracing transistors, memory, displays, solar cells, batteries, sensors, lasers and much more. This new electronics ...Read More


 
 
European Space Agency approval for Ventec material in Amphenol Invotec rigid & flex-rigid production

Amphenol Invotec, one of Europe’s leading manufacturers of complex printed circuit boards (PCBs), and Ventec International, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, are delighted to announce that Ventec's VT-901 polyimide material is now fully qualified by ESA in Amphenol Invotec’s manufacturing process for rigid and Flex-rigid PCBs.


New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

DELAWARE, OH Engineered Material Systems, Inc., a leading global supplier of negative photo resist materials for MEMS and TSV passivation/sealing applications, is pleased to introduce the DF-2005 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (metallization). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.


 
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