HOME
CURRENT ISSUE
ARCHIVE
ABOUT US
SUBSCRIBE
MEDIA KIT
中文
Login
New Products
Search :
Monday, December 01, 2008
October 2007 Issue
test
Front Page News
Tech-Op-Ed
Tech Watch
People in the News
Business News
Management
Electronic Mfg. Services
Electronic Mfg. Products
Production
Partnering
Distribution
Special Feature: PCB and Assembly
Product Preview: Productronica
New Products
Hi-Tech Events
Calendar
U.S. Tech Part Search
Powered by
Terms Of Use
Folder
Article
Weblink
Product
Forum Topic
Calendar
Form
Document
Album
FDK Intros Isolated DC-DC Converter
DC-DC converter.
San Jose, CA — FDK Corporation is introducing a regulated DC-DC converter in the industry-standard quarter brick format that provides 30 Amps (150 Watts) of output current with minimal derating at elevated temperatures. The FPQR48T5R030 is the latest in the company's Sensei Series of isolated DC-DC converters for Intermediate Bus Architecture (IBA) and Distributed Power Architecture (DPA).
It is intended for use in telecommunications, data processing, computing, and storage applications that require a regulated 5V distribution bus. According to the company, the converter operates from a 36VDC to 75VDC input and provides a tightly regulated 5VDC output. It delivers up to 30A with efficiencies in excess of 91 percent. It has a 2.30 x 1.45-in. (58.4 x 36.8mm) industry-standard quarter brick footprint and pin-out and a low body profile of 0.402-in. (10.2mm), particularly suitable for high density card-rack applications.
Features include input under-voltage lockout (UVLO), output over-current protection (OCP), output over-voltage protection (OVP), over-temperature protection (OTP), remote output voltage sense, and output voltage trim using industry-standard trim equations. The converter meets the basic insulation requirements of EN60950 and provides input-to-output DC isolation of 1500VDC.
The new converters deliver full-rated output current with little derating at high ambient temperatures without the need for heat sinks. With a 48VDC input, it provides 30A of output current in ambient temperatures up to 75°C, with 400 LFM (2m/s) airflow. This leading-edge thermal performance results from an electrical, thermal, and packaging design that is optimized for high density circuit card conditions, realized using the company's advanced circuit and thermal design techniques.
For more information, contact: FDK America, 2270 North First Street, San Jose, CA 95131-2022
408-432-8331 fax: 408-435-7478 Web:
http://www.fdkamerica.com
.
search
login