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Search :      Wednesday, January 07, 2009


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LPKF Intros Benchtop MultiLayer Press
PC board press.
Wilsonville, OR — The LPKF MultiPress S is a microprocessor-controlled benchtop multilayer lamination press, especially suitable for creating multilayer circuit boards in a lab or prototyping environment. It is useful when speed, security, or convenience are key factors in the creation of custom or prototype PC boards and is an indispensable tool in any rapid PC board prototyping situation. According to the company, the system has a reduced pressing time of less than 90 minutes, offering faster turnaround times to develop production-quality multilayer prototype boards.

The MultiPress S bonds multilayer circuits of all common rigid and flexible substrates. It delivers equal pressure on the full press plate area, creating no air pockets upon completion. With precise control of all important process parameters such as temperature, pressure and cycle times, it produces durable lamination. Nine different heating/pressing/cooling process profiles can be programmed into the system, with a maximum press area of 9 x 12-in. and temperature up to 482°F (250°C) the system can bond even RF-multilayer substrates. A powerful heating unit and efficient heat transmission for short cool-down phases reduce process times to a minimum.

When combined with a ProtoMat circuit board plotter and a through-hole conductivity solution, the MultiPress S provides the final key to producing complex multilayered printed circuit board prototypes.

For more information, contact: LPKF Laser & Electronics, P.O. Box 3858, Wilsonville, OR 97070 503-454-4202 fax: 503-682-7151 E-mail: info@lpkfusa.com Web: http://www.lpkfusa.com

See at Productronica Booth #B125; B5,481.

 

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