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Tuesday, November 21, 2017
VOLUME -22 NUMBER 10
Publication Date: 10/1/2007
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Feature: PCB and Assembly
Product Preview: Productronica
October 2007 Issue
Front Page News
Fuel Cells Power UAVs and Manned Aircraft
Atlanta, GA — Georgia Tech researchers have conducted successful test flights of a hydrogen-powered unmanned aircraft powered by a proton exchange membrane (PEM) fuel cell using compressed hydrogen. In tests, the aircraft has to date reached an altitude of 25 meters, followed down an automotive track ...
NIST Debuts Superconducting Quantum Computing Cable
Gaithersburg, MD — Physicists at the National Institute of Standards and Technology (NIST) have transferred information between two "artificial atoms" by way of electronic vibrations on a microfabricated aluminum cable, demonstrating a new component for potential ultra-powerful quantum computers of the future ...
"US Tech Interactive" Is Launched in China
Valley Forge, PA US Tech has just launched US Tech Interactive in Chinese (www.us-tech.cn), which is a fully translated and fully functional website prepared for engineers and electronics manufacturers in China.
KYZEN Climbs to New Heights
On November 2, 2017, KYZEN Employee TC Loy finally began his long-awaited quest to climb Mount Everest. After two years of preparation and delays due to Mother Nature, TC and a group of friends set out for Lukla, located in Northeastern Nepal, where locals welcomed them to the Himalayas (near Mount Everest) to begin their journey.
Nano Global, Arm Collaborate on Artificial Intelligence Chip to Drive Health Revolution by Capturing and Analyzing Molecular Data in Real Time
AUSTIN, TX - Nano Global, an Austin-based molecular data company, today announced that it is developing a chip using intellectual property (IP) from Arm, the world’s leading semiconductor IP company. The technology will help redefine how global health challenges - from superbugs to infectious diseases, and cancer are conquered.
ClassOne Slashes Via Liner Plating Costs for Compound Semi
KALISPELL, MT - ClassOne Technology (
), manufacturer of Solstice® plating systems for ≤200mm wafers, announced a new plating technique that provides significant cost reductions for compound semiconductor manufacturers who use gold plated vias.
"We have compound semiconductor customers that use gold for via liners who are switching to copper to save money," said Kevin Witt, President of ClassOne Technology.
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