Monday, October 23, 2017
VOLUME -22 NUMBER 10
Publication Date: 10/1/2007
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Archive >  October 2007 Issue >  Front Page News > 
Fuel Cells Power UAVs and Manned Aircraft

Atlanta, GA — Georgia Tech researchers have conducted successful test flights of a hydrogen-powered unmanned aircraft powered by a proton exchange membrane (PEM) fuel cell using compressed hydrogen. In tests, the aircraft has to date reached an altitude of 25 meters, followed down an automotive track ...
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NIST Debuts Superconducting Quantum Computing Cable

Gaithersburg, MD — Physicists at the National Institute of Standards and Technology (NIST) have transferred information between two "artificial atoms" by way of electronic vibrations on a microfabricated aluminum cable, demonstrating a new component for potential ultra-powerful quantum computers of the future ...Read More
"US Tech Interactive" Is Launched in China

Valley Forge, PA US Tech has just launched US Tech Interactive in Chinese (www.us-tech.cn), which is a fully translated and fully functional website prepared for engineers and electronics manufacturers in China.Read More


 
 
European Space Agency approval for Ventec material in Amphenol Invotec rigid & flex-rigid production

Amphenol Invotec, one of Europe’s leading manufacturers of complex printed circuit boards (PCBs), and Ventec International, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, are delighted to announce that Ventec's VT-901 polyimide material is now fully qualified by ESA in Amphenol Invotec’s manufacturing process for rigid and Flex-rigid PCBs.


New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

DELAWARE, OH Engineered Material Systems, Inc., a leading global supplier of negative photo resist materials for MEMS and TSV passivation/sealing applications, is pleased to introduce the DF-2005 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (metallization). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.


 
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