Thursday, July 27, 2017
VOLUME -22 NUMBER 10
Publication Date: 10/1/2007
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Archive >  October 2007 Issue >  Front Page News > 
Fuel Cells Power UAVs and Manned Aircraft

Atlanta, GA — Georgia Tech researchers have conducted successful test flights of a hydrogen-powered unmanned aircraft powered by a proton exchange membrane (PEM) fuel cell using compressed hydrogen. In tests, the aircraft has to date reached an altitude of 25 meters, followed down an automotive track ...
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NIST Debuts Superconducting Quantum Computing Cable

Gaithersburg, MD — Physicists at the National Institute of Standards and Technology (NIST) have transferred information between two "artificial atoms" by way of electronic vibrations on a microfabricated aluminum cable, demonstrating a new component for potential ultra-powerful quantum computers of the future ...Read More
"US Tech Interactive" Is Launched in China

Valley Forge, PA US Tech has just launched US Tech Interactive in Chinese (www.us-tech.cn), which is a fully translated and fully functional website prepared for engineers and electronics manufacturers in China.Read More


 
 
International Wafer-Level Packaging Conference (IWLPC) Keynote Presenters Announced
SAN JOSE, CA - The SMTA and Chip Scale Review are pleased to announce the Keynote Presenters for the 14th annual International Wafer-Level Packaging Conference. The IWLPC will be held October 24-26, 2017 at the DoubleTree by Hilton Hotel in San Jose, California.


LUTZE Introduces Teal Ethernet Cat5e Cable
CHARLOTTE, NC - Data transmission is critical for success in today’s manufacturing environment. LUTZE’s new flexible Cat5e AWM 600V Ethernet cable (part#104349) is engineered to protect your data from harmful interference ensuring uninterrupted data transmission and long term network reliability.
 

NXP Announces Production of Security Chips in its US Manufacturing Facilities
AUSTIN, TX; CHANDLER, AZ - NXP Semiconductors N.V. today announced a $22 million dollar program that expands its operations in the United States, enabling the Company’s US facilities to manufacture security chips for government applications that can support critical US national and homeland security programs.
 

 
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