HOME
CURRENT ISSUE
ARCHIVE
ABOUT US
SUBSCRIBE
MEDIA KIT
中文
Login
Product Preview: ATExpo & IPC MW
Search :
Monday, December 01, 2008
September 2007 Issue
test
Front Page News
Tech-Op-Ed
Tech Watch
People in the News
Business News
Management
Electronic Mfg. Services
Electronic Mfg. Products
Production
Partnering
Distribution
Special Feature: SMT & Production
Product Preview: ATExpo & IPC MW
New Products
Hi-Tech Events
Calendar
U.S. Tech Part Search
Powered by
Terms Of Use
Folder
Article
Weblink
Product
Forum Topic
Calendar
Form
Document
Album
EFD
®
Intros No-Drip Solder Paste
Perfect solder joint on heat tube.
East Providence, RI — EFD
®
, Inc., a subsidiary of Nordson Corporation is introducing a new no-drip, SAC305 solder paste dispensing formulation for mechanical soldering. This lead-free, no-clean formulation is excellent for gap filling and application on vertical surfaces.
The new formulation was created to help users solder a perfect joint around a heat tube (or heat sink) container. Research found that competitors' formulations would drip down the container during the reflow process and create an insufficient solder joint. In contrast, EFD's no-drip formulation wets well and wicks around many metal surfaces like silver, silver-plated, nickel, brass, and copper to produce perfect solder joints.
For more information, contact: EFD Inc., 977 Waterman Ave., East Providence, RI 02914. 14 Blackstone Valley Place, Lincoln, RI 02865
401-333-3800 fax: 401-333-4954 E-mail: solder@efd-inc.com Web:
http://www.efd-inc.com
See at IPC Midwest Booth #418.
search
login