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Monday, December 01, 2008
September 2007 Issue
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Heraeus: Conductive and Non-Conductive Adhesives
Conductive adhesives fill hi-temp needs.
West Conshohocken, PA — The PC 3000 Series of one-component, solvent- and lead-free fast-curing conductive adhesives from Heraeus is designed for the connection of components (SMDs, LEDs and bare die) with LTCC, flexible and ceramic substrates. With excellent electrical and thermal conductivity properties, the PC 3000 Series of isotropic conductive adhesives (ICA) reportedly offers high reliability and is complementary to processes involving dispensing, screen and stencil printing. The conductive adhesives produce minimal outgassing during the curing process.
The use of conductive adhesives is especially suitable for processes involving sensitive substrates and components and has advantages in fine pitch or flip-chip applications. The PC 3000 Series of flexible ICAs can be used to assemble die and components to substrates for high temperature automotive applications such as engine control modules, motor controls and safety equipment.
Other applications include die attach on lead frames or flex PC board materials for electronic and semiconductor components or assembly of flexible circuits used in cellular phones or other communication devices. The company's NCA-9 series of non-conductive adhesives is a one-component, solvent-free, low temperature, fast-curing thermosetting adhesive. The NCA series is designed for the connection of temperature-sensitive bare die and SMT components such as LEDs or sensitive substrates like foil circuits used on smart cards or RFID tags or other low-cost materials. Depending on the required viscosity, the non-conductive adhesive can be dispensed or printed.
For more information, contact: Heraeus, 24 Union Hill Rd., West Conshohocken, PA 19428
610-825-6050 fax: 610-825-7061 Web:
http://www.4cmd.com
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