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Special Feature: SMT & Production
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Thursday, November 20, 2008
September 2007 Issue
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Automating Tight Dispensing Needs
By Cliff R. Bockard, Vice President, Global Automation Inc., Old Saybrook, CT
Over the last few years, the manufacture of medical equipment has grown to the point where a number of operations have become fully automated. One of these applications is the automation of the dispensing processes. Dispensing of fluids, liquid or viscous, such as epoxies, silicones ...
Components Handling for Lean Electronic
By Ed Romaine, Remstar International, Inc., Westbrook, ME
Conventional rack, shelving and drawer systems used in electronic component manufacturing facilities are a "less than lean" method of storing these small, sensitive items. Locating and retrieving electronic components stored in these traditional systems wastes time, floor space, increases ...
Flux Jet Technology for Lead-Free Soldering
By Richard Burke and Ken Kirby, Speedline Technologies, Franklin, MA
The trend toward environmentally responsible electronics assembly is well-documented. Regulations banning the use of lead, such as Europe's RoHS directive, are driving similar initiatives throughout the world. While many manufacturers have implemented lead-free wave soldering, both ...
Robotic Dispensing: Keeping a Lid on Costs
By Arnold Fletcher
Today's manufacturing processes call for dispensing fluids that include adhesives, acids, alcohol, anaerobic resins, conformal coatings, cyanoacrylates, oils, grease, lubricants, silicones, gels, solder pastes, sealants, solvents and UV adhesives.
Successfully Reworking Area Array Devices
By Patrick McCall, Director of Engineering, PACE Inc., Southern Pines, NC
Area array and other components that do not have accessible leads once mounted on a printed circuit board are extremely common in today's electronics. The ability to remove and replace them by the service industry is a critical competency. These types of components have gained significant ...
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