Monday, October 23, 2017
VOLUME -22 NUMBER 9
Publication Date:09/1/2007
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Archive >  September 2007 Issue >  Front Page News > 
Fuel Cell Auto Sets Speed Record

Wendover, UT — It's long been a maxim of the automotive industry that racing cars often use innovative technology that later becomes mainstream for the consumer. And this appears to be the case with the Ford Motor Company (NYSE: F) and its high-powered fuel-cell electric vehicle that recently set ...
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China Biggest RFID Market this Year

Cambridge, UK — This year, for the first time, China has become the world's largest market for RFID by value. According to a new report "RFID in China 2007-2017", China has become for the first time, the world's largest market for RFID by value. In 2007, the amount spent on RFID in East Asia will be $2.7 billion ...Read More
Boeing Bids on Next Gen GPS System

St. Louis, MO — The Boeing Company (NYSE: BA) has submitted its proposal to the U.S. Air Force for the development and production of up to 12 Global Positioning System (GPS) III satellites. The enhanced orbiters will offer positioning service that is 10 times better than today's system as well as improved anti ...Read More
LCD Monitor Panel Shipments at Record Highs

Austin, TX — DisplaySearch has released its July LCD panel shipments results. Specifically, the firm said that LCD TV panel shipments hit an all-time high with 7.2 million units shipped, up 6 percent M/M and 72 percent Y/Y. In addition, notebook PC panel shipments increased 7 percent M/M and grew an impressive ...Read More
RIT & AmberWave Collaborate on New Semicon Research

Salem, NH — AmberWave Systems, along with Rochester Institute of Technology (RIT), have been awarded a three-year research grant from the National Science Foundation (NSF). The research grant will allow the two organizations to explore the integration of compound semiconductor devices on silicon using a technique ...Read More


 
 
European Space Agency approval for Ventec material in Amphenol Invotec rigid & flex-rigid production

Amphenol Invotec, one of Europe’s leading manufacturers of complex printed circuit boards (PCBs), and Ventec International, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, are delighted to announce that Ventec's VT-901 polyimide material is now fully qualified by ESA in Amphenol Invotec’s manufacturing process for rigid and Flex-rigid PCBs.


New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

DELAWARE, OH Engineered Material Systems, Inc., a leading global supplier of negative photo resist materials for MEMS and TSV passivation/sealing applications, is pleased to introduce the DF-2005 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (metallization). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.


 
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