Sunday, December 4, 2016
VOLUME -22 NUMBER 9
Publication Date:09/1/2007
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Archive >  September 2007 Issue >  Front Page News > 
Fuel Cell Auto Sets Speed Record

Wendover, UT — It's long been a maxim of the automotive industry that racing cars often use innovative technology that later becomes mainstream for the consumer. And this appears to be the case with the Ford Motor Company (NYSE: F) and its high-powered fuel-cell electric vehicle that recently set ...
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China Biggest RFID Market this Year

Cambridge, UK — This year, for the first time, China has become the world's largest market for RFID by value. According to a new report "RFID in China 2007-2017", China has become for the first time, the world's largest market for RFID by value. In 2007, the amount spent on RFID in East Asia will be $2.7 billion ...Read More
Boeing Bids on Next Gen GPS System

St. Louis, MO — The Boeing Company (NYSE: BA) has submitted its proposal to the U.S. Air Force for the development and production of up to 12 Global Positioning System (GPS) III satellites. The enhanced orbiters will offer positioning service that is 10 times better than today's system as well as improved anti ...Read More
LCD Monitor Panel Shipments at Record Highs

Austin, TX — DisplaySearch has released its July LCD panel shipments results. Specifically, the firm said that LCD TV panel shipments hit an all-time high with 7.2 million units shipped, up 6 percent M/M and 72 percent Y/Y. In addition, notebook PC panel shipments increased 7 percent M/M and grew an impressive ...Read More
RIT & AmberWave Collaborate on New Semicon Research

Salem, NH — AmberWave Systems, along with Rochester Institute of Technology (RIT), have been awarded a three-year research grant from the National Science Foundation (NSF). The research grant will allow the two organizations to explore the integration of compound semiconductor devices on silicon using a technique ...Read More


 
 
Murphy, Choh and Pilla Join ClassOne Technology's Board of Advisors
KALISPELL, MT - ClassOne Technology (www.classone.com), manufacturer of advanced wet processing equipment for ≤200mm substrates announced the formation of a Board of Advisors. This body will be made up of highly-regarded senior executives from the semiconductor industry who will provide their perspective and guidance to ClassOne as it navigates the expansion of its operations.
 

Indium Corporation’s Karch Recognized for Best Presentation at IMAPS Autumn Conference 2016
CLINTON, NY - Indium Corporation’s Andreas Karch, Regional Technical Manager for Germany, Austria and Switzerland, was recognized for his technical presentation at the IMAPS Autumn Conference in October in Munich, Germany.

Karch was awarded “Best Presentation” for the session New Solder Material Technology in the Manufacturing Process of IGBT Modules, which discussed a new method that produces strong, reliable solder joints that resist cracking and thermal fatigue.

Ventec International Group Focus On High Thermal Performance Materials for Automotive and LED Applications at HKPCA 2016, China
SUZHOU, CHINA - Ventec International Group, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, will exhibit in Booth #4B16 at HKPCA, China, scheduled to take place December 7th-9th, 2016 at the Shenzhen Convention & Exhibition Center, China.

 
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