Sunday, May 27, 2018
VOLUME -22 NUMBER 9
Publication Date:09/1/2007
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Archive >  September 2007 Issue >  Front Page News > 
Fuel Cell Auto Sets Speed Record

Wendover, UT — It's long been a maxim of the automotive industry that racing cars often use innovative technology that later becomes mainstream for the consumer. And this appears to be the case with the Ford Motor Company (NYSE: F) and its high-powered fuel-cell electric vehicle that recently set ...
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China Biggest RFID Market this Year

Cambridge, UK — This year, for the first time, China has become the world's largest market for RFID by value. According to a new report "RFID in China 2007-2017", China has become for the first time, the world's largest market for RFID by value. In 2007, the amount spent on RFID in East Asia will be $2.7 billion ...Read More
Boeing Bids on Next Gen GPS System

St. Louis, MO — The Boeing Company (NYSE: BA) has submitted its proposal to the U.S. Air Force for the development and production of up to 12 Global Positioning System (GPS) III satellites. The enhanced orbiters will offer positioning service that is 10 times better than today's system as well as improved anti ...Read More
LCD Monitor Panel Shipments at Record Highs

Austin, TX — DisplaySearch has released its July LCD panel shipments results. Specifically, the firm said that LCD TV panel shipments hit an all-time high with 7.2 million units shipped, up 6 percent M/M and 72 percent Y/Y. In addition, notebook PC panel shipments increased 7 percent M/M and grew an impressive ...Read More
RIT & AmberWave Collaborate on New Semicon Research

Salem, NH — AmberWave Systems, along with Rochester Institute of Technology (RIT), have been awarded a three-year research grant from the National Science Foundation (NSF). The research grant will allow the two organizations to explore the integration of compound semiconductor devices on silicon using a technique ...Read More


 
 
Indium Corporation to Feature AuSn Solder Preforms at International Microwave Symposium
CLINTON, NY - Indium Corporation will feature its precision AuSn solder preforms at International Microwave Symposium (IMS) 2018 from June 10-15 in Philadelphia, Penn.

Indium Corporation’s AuSn preforms have the highest tensile strength of any solder, ensuring high-reliability for joining and sealing.         

SEMICON WEST Adds WT | Wearable Technologies Conference Co-Location: Premier U.S. electronics manufacturing event expands with wearables program
MILPITAS, CA - SEMI, the global industry association representing the electronics manufacturing supply chain, today announced that the WT | Wearable Technologies Conference 2018 USA will co-locate July 11-12 with SEMICON West 2018 in San Francisco.         
Flex Power Modules announces new BGA packaging option for digital point-of-load DC/DC converters
Flex Power Modules today announced that its BMR466 and BMR461 digital point-of-load (POL) DC/DC power modules are now available to customers with BGA (Ball Grid Array) packaging, as well as in their original compact LGA (Land Grid Array) package.        
 
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