Save. Share. Connect.
Sunday, May 28, 2017
VOLUME -22 NUMBER 8
Publication Date: 08/1/2007
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Components & Disty
Product Preview: ATExpo & IPC MW
August 2007 Issue
People in the News
Add Message Board
Patrick Trippel Named President of Henkel's Aerospace Group
Irvine, CA — Henkel Corporation has appointed Patrick Trippel to the position of President of the company's aerospace group. Trippel currently serves as President of the electronics group of Henkel and will maintain these duties while expanding his role to include leadership of the aerospace business.\par \Since joining Henkel in 2002, Trippel has been instrumental in streamlining the electronics group's manufacturing and R&D operations and its global footprint. He has modernized the materials business by incorporating a methodology and global structure that allows for the development and deployment of proven, tested and guaranteed compatible materials for the entire semiconductor and printed circuit board assembly value chains. With the manufacturing and delivery synergies between Henkel's electronics and aerospace businesses, Trippel is well-positioned to apply many of the electronics group's successes to the aerospace operation, taking it to the next level.
In the 5 years that Trippel has been with Henkel, new manufacturing, technical and sales facilities have been established in strategic locales worldwide, including Henkel's multi-million dollar Irvine, California-based Advanced Research and Applications Lab which serves as the electronic group headquarters location.
Included among Trippel's other corporate expansion activities are a successful joint venture with mold compound formulator and supplier Huawei Electronics and the acquisition of solder sphere manufacturer Accurus Scientific Company Limited, two portfolio additions which have effectively extended the Henkel product line and enabled Henkel to become a single-source materials supplier for the complete electronics assembly and semiconductor packaging value chains.
© 2015 USTECH. All Rights Reserved. |
Contact Us: 610-783-6100 | firstname.lastname@example.org
powered by GIM