Save. Share. Connect.
Tuesday, August 22, 2017
VOLUME -22 NUMBER 8
Publication Date: 08/1/2007
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Components & Disty
Product Preview: ATExpo & IPC MW
August 2007 Issue
Add Message Board
Mating Pin Headers from Mill-Max
Mating pin headers.
Oyster Bay, NY — Mill-Max is introducing a family of SPDIP mating pin headers to complement its line of SPDIP sockets. SPDIP (Shrink Plastic) packaging reduces device lead spacing between pins down to 0.070-in. pitch (1.778mm). This technology is utilized in memory, microcontrollers, video controllers and automotive design applications.
DIP and SIP headers are valuable for interconnect applications, such as: board stacking, socket testing and elevating circuits off the board surface.
The SPDIP headers are precision-machined using brass alloy 360 and are configured with pluggable tails. They easily mate to their corresponding SPDIP sockets.
For more information, contact: Mill-Max Mfg. Corp., P.O. Box 300, Oyster Bay, NY 11771-0300.
516-922-6000; fax: 516-922-9253 Web:
© 2015 USTECH. All Rights Reserved. |
Contact Us: 610-783-6100 | firstname.lastname@example.org
powered by GIM