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VOLUME -22 NUMBER 8
Publication Date: 08/1/2007
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August 2007 Issue
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Advanced: Interposers Mate Lead-Free BGA to Tin/Lead
BGA interposer adapter.
West Warwick, RI — New BGA Interposers from Advanced Interconnections are a cost-effective method for converting lead-free BGA device packages for use on boards processed with lower temperature, Tin/Lead solder profiles. Designed for RoHS exempt applications, Interposers from Advanced solve BGA device transition, obsolescence, and solderability issues associated with the higher temperature requirements to process lead-free BGA packages. The company's turnkey solution consists of lead-free BGA device attach to an Interposer adapter board in a high temperature reflow process, followed by mounting of eutectic (63/37) Tin/Lead solder balls on the bottom of the Interposer. The compact Interposer assembly is shipped ready for use on existing PC boards, eliminating the need to change Tin/Lead solder profiles or subject other components to higher processing temperatures.
The complete Interposer solution includes high temperature, FR-4 adapter boards that closely match the original package size, industry-proven eutectic (63/37) Tin/Lead solder balls, and in-house lead-free BGA device attach. Device-specific Interposers match the device footprint and are currently available in 0.80, 1.00, and 1.27mm pitch. Tape-and-reel packaging is available. Enhanced designs in finer pitch or with specific signal integrity requirements are available on a custom basis.
For more information, contact: Advanced Interconnections Corp., 5 Energy Way, West Warwick, RI 02893
800-424-9850 or 401-823-5200; fax: 401-823-8723 E-mail: firstname.lastname@example.org Web:
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