Sunday, April 22, 2018
Publication Date: 08/1/2007
Archive >  August 2007 Issue >  Product Preview: ATExpo & IPC MW > 

DEK's Virtual Panel Carrier Stays in Alignment
Virtual panel carrier.
Flemington, NJ — DEK has developed Virtual Panel Carrier (VPC), describing it as a ground-breaking substrate centering and carrier technology. VPC enables multiple component support and alignment during screen printing and all subsequent assembly processes.

Traditional carrier technology used for processing small components generally requires individual component alignment and processing or the use of specialized and costly custom tooling to bring components into common alignment for printing. With all of the current systems, separate alignment processes for each component must be carried out at every process stage, thus resulting in less than especially suitable throughput and expense. The new VPC technology alleviates these issues by enabling the components to be aligned once in the VPC for screen printing. Once this alignment occurs, no further adjustments are required for any of the subsequent assembly processes.

According to the company, with equal force being applied to each side of the substrate or device, centering is consistent with no chance for even slight misregistration. Plus, the system utilizes VPC's global fiducials instead of individual component fiducials, which simplifies all stages of assembly and dramatically improves UPH.

Using a special design that consists of a base carrier with a low-maintenance consumable foil, VPC provides the stability, centering and alignment capabilities required to process multiple substrates or components in a single panel, dramatically improving throughput. Parts are placed in the carrier either manually or loaded by a placement system. Substrates are held in the carrier by a patented 4-sided tensioning mechanism and then aligned within the carrier using an innovative centering system. Parts are referenced using two global fiducials — as opposed to individual component fiducials — thus enabling the easy transfer of VPC throughout all assembly processes. The system is also scalable, allowing manufacturers to adjust component quantity for individual processing requirements.

For more information, contact: DEK, 8 Bartles Corner Rd., Flemington, NJ 08822 908-782-4140 fax: 908-782-4774 Web:

See at IPC Midwest Booth #409.

search login