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Heraeus Intros Water Soluble Ball Dip Paste
Ball dip paste.
West Conshohocken, PA — Heraeus has introduced a new line of water-soluble ball dip pastes for solder on pad (SOP) substrates. The BD paste series enables manufacturers to utilize SOP substrates while maintaining outstanding yields. Since the convex surface of the SOP substrate causes solder ball movement during reflow when using the traditional flux and drop process, the BD paste allows the balls to be dipped in solder before placement. This prevents ball movement and eliminates the need for printing of solder paste or flux.

The ball dip pastes are based on the outstanding ball attach flux (TFP41) which is formulated with nonionic surfactants, tackifying agents, rheology modifiers and a blend of halide and non-halide containing activators. The BD paste series also features Type 5, 6 or Type 8 solder powders that are manufactured in a proprietary process that ensures an extremely tight PSD while maintaining a very low oxide level. The Heraeus ball dip series of solder pastes exhibit easy cleaning in low standoff applications, resulting in high reliability in a variety of processes.

For more information, contact: Heraeus, 24 Union Hill Rd., West Conshohocken, PA 19428 610-825-6050 fax: 610-825-7061 Web: http://www.4cmd.com

 

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