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TechFilm Intros Thermally Conductive Adhesive Film
Thermally conductive adhesive film.
Billerica, MA — TechFilm, LLC has introduced T2581, a thermally conductive electrically isolating structural film adhesive specifically formulated for demanding high-temperature applications. According to the company, this new structural adhesive provides excellent thermal transfer performance coupled with excellent adhesion to silicon, kovar, ceramic, aluminum and copper substrates. Designed with excellent characteristics for manufacturability, T2581 delivers stable room temperature performance for 2 weeks yet can be cured at temperatures between 130 to 150°C.

Typical applications include structural bonds in hybrid and high reliability microelectronics, microwave antennas, and power generating applications.

Available in sheet or roll format up to 18-in. wide, this material can be provided as a film or laser or diecut preforms in thicknesses from 1.5 to 7 mils.

For more information, contact: TechFilm Corporation, 31 Dunham Rd., Billerica, MA 01821. 888-832-4345. Web: http://www.techfilm.com

 

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