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Wednesday, January 18, 2017
VOLUME -22 NUMBER 8
Publication Date: 08/1/2007
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August 2007 Issue
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JPSA Intros Automated Versatile Laser Workstation
Automated laser workstation.
Manchester, NH — J. P. Sercel Associates Inc. (JPSA) has introduced its new IX-4000 series laser workstation, available in both DPSS (solid state) and Excimer laser configurations. The new IX-4500 ChromaDice
solid state laser machining system delivers high speed wafer singulation integrated with a state-of-the-art wafer loading system.
According to the company, the new workstation has dual SMIF or FOUP load ports, so it is ready for the most demanding wafer die singulation production task. With operation costs of less than $2 per wafer, >99 percent process yields combined with ultra narrow kerf widths. Available with wavelengths from 1064nm to 266nm, the IX-4500 is ready for processing a variety of materials, from Si to Sapphire and, when equipped with the company's patent-pending Toxic Wafer Debris nozzle, materials such as GaAs and InP are handled with ease.
The IX-4000 ChromAblate
is an excimer laser version for LED liftoff, via drilling, micromachining, thin film patterning and many other semiconductor packaging applications. Whether micromachining features to 2µm or configured for large area exposure of up to 5 x 5mm, the IX-4000 is engineered for 24/7 industrial production with a high degree of flexibility and configurability. This high-performance system provides dual cassette loading ports, production-grade robotics, wafer pre-aligners and vision, all combined in a user-friendly Class I laser system.
Applications include laser lift-off, selective wafer annealing, micro-drilling, dicing and scribing, ink jets, via drilling, blind holes, microfluidics, thin film patterning, selective material ablation, MEMS, 3-D micromachining, fire-on-the-fly operation and more.
The system provides full automation, including part load/unload robotics, pre-aligners and vision system for unattended production. A variety of standard and custom end effectors are available for any part-handling requirement. Its compact design, modular
configuration, high accuracy, with linear motor air bearing stages reportedly provide accuracies to less than 2µm. It also offers a large workspace, as it can be configured with stages able to handle wafers up to 300mm. In addition, the system provides a uniform beam profile, with a variety of imaging and non-imaging homogenizers available for the most demanding large-area applications.
For more information, visit www.jpsalaser.com, or contact the JPSA, 220 Hackett Hill Rd., Manchester, NH, 03102
603-518-3200 fax: fax: 603-518-3298 Web:
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