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Saturday, December 16, 2017
VOLUME -22 NUMBER 8
Publication Date: 08/1/2007
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Components & Disty
Product Preview: ATExpo & IPC MW
August 2007 Issue
Front Page News
Aging AWACS Gets Money-Saving Diagnostics
By Walter Salm
Kissimmee, FL — We're not too far removed from a time when the DoD came under fire for overly costly toilet seats and hammers, so it's especially gratifying to find a company that has saved many millions of dollars of taxpayer money for the government.
Active RFID On the Upswing
Cambridge, UK — Will active (battery powered) RFID overtake the more common passive variety? It represents a high growth segment of the total RFID market, according to "The IDTechEx report Active RFID and Sensor Networks 2007-2017."
Flex Circuits Continue Strong Showing
Bannockburn, IL — Rigid PCB shipments are down 14.8 percent and bookings are down 12.2 percent in May 2007 from May 2006. Year to date, rigid PCB shipments are down 10.9 percent and bookings are down 17.7 percent, according to the latest report from
SEMI: North American Semiconductor Equipment Industry Posts November 2017 Billings
MILPITAS, CA - North America-based manufacturers of semiconductor equipment posted $2.05 billion in billings worldwide in November 2017 (three-month average basis), according to the November
Equipment Market Data Subscription
(EMDS) Billings Report published today by SEMI.
Avnet Sponsors The Not Impossible Awards Recognizing Emerging Technologies that Improve Lives
Avnet, a leading global technology distributor, today announced its title sponsorship of The Not Impossible Awards, which recognizes the breakthrough achievements of innovators who share the Not Impossible Labs mission to create inventive technology that improves the well-being of others.
aveni® S.A. Extends Copper Interconnects to 5nm and Below for BEOL Integration Using Innovative Electroplating Chemistry
MASSY, France - aveni S.A., developer and manufacturer of market-disrupting wet deposition technologies and chemistries for 2D interconnects and 3D through silicon via packaging, today announced it has obtained results that strongly support the continued use of copper in the back end of line (BEOL) for advanced interconnects, at and beyond the 5nm technology node.
Kilopass NVM OTP IP Achieves 3-Lot Qualification on GLOBALFOUNDRIES 14nm LPP (Low Power Process) Process Technology
SAN JOSE, CA - Kilopass Technology Inc., a leading provider of semiconductor logic embedded non-volatile memory (eNVM) intellectual property (IP), today announced that it successfully achieved a three-lot qualification on GLOBALFOUNDRIES (GF) 14nm LPP (Low Power Process) technology platform for its one-time programmable (OTP) NVM technology.
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