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VOLUME -22 NUMBER 7
Publication Date: 07/1/2007
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Electronic Mfg. Services
Electronic Mfg. Products
Components and Distribution
Product Preview: SEMICON WEST
July 2007 Issue
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Endicott's Interconnect Solution Reduces PTHs
Interconnects reduce through-holes.
Endicott, NY — The HPC-Z interconnect from Endicott Interconnect Technologies solves thick board drilling and wire density problems, and meets the need for functional isolation, with the capability of isolating high-speed channels on one sub-assembly and low-speed channels on another. It provides interconnections within the board, and eliminates unnecessary PTH drilling. According to the company, this development eliminates the need to drill plated-thru-holes (PTHs) to make signal connections within PC boards. The new HPC-Z interconnection technology provides signal connections only where desired, with functional isolation for single or double side surface mount partitions.
HPC-Z provides a "PTH-like" connection at lamination with a pad-to-pad connection made with conductive epoxy. Since there is vertical connection with a lamination in place of a PTH, aspect ratios for drill and plate are limited to sub-assembly dimensions.
For example, instead of having to drill 3 PTHs all the way though the board with a 10 mil drill for each of 3 sub-assemblies, now it is possible to have 3 PTHs on one, 2 PTHs, on another, and 1 PTH on another — whatever is needed, and no more than is needed. This minimizing of the PTH effect results in increased wiring density due to smaller vias and lands. With HPC-Z, there are more wiring lines are available that would have been closed off by PTH drilling.
For more information, contact: Endicott Interconnect Technologies, Inc., 1701 North Street, Endicott, NY 13760.
866-820-4820; fax: 607-755-9963. Web:
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