Save. Share. Connect.
Thursday, August 17, 2017
VOLUME -22 NUMBER 7
Publication Date: 07/1/2007
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Components and Distribution
Product Preview: SEMICON WEST
July 2007 Issue
Add Message Board
FDK Intros Smallest POL Converters
Smallest footprint converter.
San Jose, CA — FDK Corporation has added two new high performance DC/DC converters to its Senpai Series of non-isolated point-of-load (POL) converters. The FPMR12TR7510 converter operates from a 6.0 to 14.0VDC input bus, and delivers up to 10 Amp in what is described as the smallest industry-standard footprint. The converter reportedly provides up to 67 percent higher output current than other available POL converters in the same input voltage range. The second unit, the FPLR05SR7525 converter, operates from a 3.0 to 5.5VDC input bus, and delivers up to 25A in the next smallest industry-standard footprint, providing up to 25 percent higher output current than other available POL converters in the same size and input voltage range.
The FPMR12TR7510 converter is offered in a 0.9 x 0.4 x 0.195-in. (22.9 x 10.2 x 4.95mm) industry-standard SIP package and provides a tightly-regulated programmable output voltage in the range of 0.75 to 5.5VDC. The FPLR05SR7525 converter comes in a 1.30 x 0.53 x 0.327-in. (33.0 x 13.4 x 8.3mm) SMD package with industry-standard footprint and pin-out and provides a tightly-regulated programmable output voltage in the range of 0.75 to 3.63VDC. Both models have remote ON/OFF, over-current and over-temperature protection, and output voltage adjust, and are compatible with standard trim equations.
The converters are designed for Intermediate Bus Architecture (IBA) and Distributed Power Architecture (DPA) applications that require high efficiency, tight regulation, and high reliability in elevated temperature environments. They reportedly deliver full-rated output current with no derating in ambient temperatures of up to 60 and 70°C, respectively, with 400LFM (2m/s) airflow. This leading-edge thermal performance results from electrical, thermal, and packaging design that is optimized for high density circuit card conditions.
For more information, contact: FDK America, 2270 North First Street, San Jose, CA 95131-2022
408-432-8331 fax: 408-435-7478 Web:
© 2015 USTECH. All Rights Reserved. |
Contact Us: 610-783-6100 | email@example.com
powered by GIM