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 VOLUME 22-NUMBER 7                                                                     Search :     Wednesday, August 20, 2008                                                                        JULY, 2007




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Book-to-Bill at Parity
Bannockburn, IL — Domestic rigid PCB shipments for the month of April are down 12.8 percent and bookings are down 11.8 percent from April 2006, according th\o figures released by the IPC - Association Connecting Electronics Industries®. Year to date, rigid PCB shipments are down 9.9 percent and bookings are down 18.9 percent. Compared to the previous month, rigid PCB shipments decreased 15.5 percent and rigid bookings decreased 12.6 percent. Yet, the book-to-bill ratio for the North American rigid PCB industry in April 2007 reached parity at 1.00, which is a sign of near-term stability.

Flexible circuit shipments in April 2007 were up 3.0 percent and bookings were up 68.9 percent compared to April 2006. Year to date, flexible circuit shipments are up 3.9 percent and bookings are up 30.1 percent. Compared to the previous month, however, flexible circuit shipments decreased 25.1 percent and flex bookings were down 39.2 percent. The North American flexible circuit book-to-bill ratio jumped to 1.28 in April, indicating probable sales growth in the near term.

For rigid PCBs and flexible circuits combined, industry shipments in April 2007 decreased 12.0 percent from April 2006, and orders booked decreased 8.5 percent from April 2006. Year to date, combined industry shipments are down 9.1 percent and bookings are down 16.5 percent. Compared to the previous month, combined industry shipments for April 2007 are down 16.2 percent and bookings are down 15.3 percent. The combined (rigid and flex) industry book-to-bill ratio in April 2007 increased to 1.01.


For more information:
http://www.ipc.org


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By Al Lewis, Director of Applications Engineering,
Asymtek, Carlsbad, CA
Fluid dispensing and coating processes are required for many assembly and packaging operations. These processes provide combinations of electrical, mechanical, and thermal properties to components and assemblies for functionality or enhanced reliability. Common processes are surface mount component bonding for assembly, encapsulation and underfill for reliability,
By Tom Adams, teadams@earthlink.net
The idea of putting components inside the printed wiring board instead of on the surface of the board has been around for at least 30 years, although it has been limited to passive components such as the thin film resistive material made by Ohmega Technologies, and more recently the resistor/capacitor laminate core made by Ohmega and Oak/Mitsui. The endless drive toward smaller systems, however, means that attention is being given to placing active components inside the board as well.
 Eastek International: Integrated Global Svcs.
By Bob Wiegand, Vice President, Eastek Int'l, Buffalo Grove, IL
For many entrepreneurs, identifying a U.S.-based contract manufacturer that offers a "one-stop shop" solution can help transform an important new product idea into reality. But how to find a CM partner that offers an accommodating yet disciplined process, with sound leadership and support throughout all phases of design and production?
 Datron: Hi-Speed CNC with     Micro Tool Machining
Milford, NH — New from Datron is its excelsior® Lite CNC machining center. The system, for parts that are 1/4-in. or smaller in size, has been designed specifically for manufacturers who need innovative high-speed technology on a budget.

The excelsior Lite has an aluminum bed rather than the granite table found on its big brother the excelsior EX. While this does impact rigidity to some extent,
 Samtec Expands Signal    Integrity Product Line
New Albany, IN — Samtec has expanded its signal integrity interconnect product line, increasing the ability to provide "Signal Integrity at any Distance" The company has introduced new interconnects and signal integrity services for panel and I/O, cable assemblies and board-to-board applications, as well as expanded signal integrity design resources including Final Inch® PC board design tools.

Asymtek: New Inline Flux Dispensing System
Carlsbad, CA — Asymtek, a Nordson company, is unveiling its new Axiom X-1030 Series dispensing system, designed for selective jetting of traditional flux, no-clean solder fluxes and other precise coating applications.

Available in single or dual lane configurations, the closed-loop X-1030 dispensing system optimizes underfill and package reliability--improving production throughput and equipment utilization by as much as 60-85 percent with the X-1032's dual lane multitasking capabilities.

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