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Cobar: No-Clean Lead-free Solder Paste
Lead-free no-clean solder paste.
Londonderry, NH — Cobar Solder Products' SAC3 XM5S no-clean solder paste for lead-free SMT assembly reportedly produces void-free lead-free solder joints, characterized by excellent wetting. The paste is the company's mainstay no-clean solder paste for lead-free SMT assembly. Its proprietary synthetic base gives it stability under the higher temperatures required by lead-free alloys. According to the company, it will not slump when heated, and works well in air or under a nitrogen blanket. It is compatible with many different finishes including OSP, Ni/Au, Ag and Sn.

The paste reportedly prints well with good definition, and is designed specifically for stencil printing without smearing. It cuts down on the frequency of stencil wiping required. It remains stable and active during extended heating at elevated temperatures. The recommended soldering temperature range is 235 to 245°C. The Sn96.5/Ag4/Cu0.5 alloy is available in most common SAC-alloys, including an anti-Tombstoning type, and in several powder classes.

For more information, contact: Cobar Solder Products, 53 Wentworth Avenue, Londonderry, NH 03053 603-432-7500 fax: 603-432-7519. Web: http://www.cobar.com

 

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