Saturday, April 21, 2018
VOLUME -22 NUMBER 7
Publication Date: 07/1/2007
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Archive >  July 2007 Issue >  Front Page News > 
Transparent Transistors Herald New Displays, E-Paper


West Lafayette, IN — Researchers at Purdue University have used nanotechnology to create transparent transistors and circuits, a step that promises a broad range of applications, from e-paper and flexible color screens for consumer electronics to "smart cards" and "heads-up" displays ...
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Quantum Key System Combines Speed & Distance

Gaithersburg, MD — Researchers at the National Institute of Standards and Technology (NIST) have built a prototype high-speed quantum key distribution (QKD) system, based on a new detector system that achieves dramatically lower noise levels than similar systems. The new system, they say, can perform a theoretically ...Read More
Book-to-Bill at Parity

Bannockburn, IL — Domestic rigid PCB shipments for the month of April are down 12.8 percent and bookings are down 11.8 percent from April 2006, according th\o figures released by the IPC - Association Connecting Electronics Industries®. Year to date, rigid PCB shipments are down 9.9 percent and bookings are ...Read More


 
 
SMTA Europe's Harsh Environments Conference Session 7 to Focus on Hi-Temp Mats/Fab
SMTA Europe announces Session 7 Technical Program on High Temperature PCB Materials and Fabrication at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.      
EOS WLC550 series offers maximum Cooling Flexibility on Standard Footprint
Last week at the MT-CONNECT in Nuremberg more than 150 companies from the European MedTec Business met for discussing the latest trends and guidelines in MedTec industry. When EOS power presented its medical up to class-2 powersupplies at MT-CONNECT, the EOS team made an exciting observation: While everyone is still talking about the size of the powersupplies, which is still very true for home devices, the real crucial factor for sales support for larger devices at the MT connect was the cooling.   
SEMI and TechSearch International Report Global Semiconductor Packaging Materials Market Reaches $16.7 Billion

MILPITAS, CA SEMI, the industry association representing the global electronics manufacturing supply chain, and TechSearch International today reported that the global semiconductor packaging materials market reached $16.7 billion in 2017. While slower growth of smartphones and personal computers – the industry’s traditional drivers – is reducing material consumption, the slowdown was offset by strong unit growth in the cryptocurrency market in 2017 and early 2018. Flip chip package shipments into the cryptocurrency market, while providing a windfall to many suppliers, are not expected to remain at high levels.  


C&K ANNOUNCES THAT IT HAS ACQUIRED VUILLERMOZ
Newton, MA – C&K, one of the world’s most trusted brands of high-quality electromechanical switches, today announces that it has acquired the company Vuillermoz, a micro-mechanical components and tooling company located in St. Claude, France.



 
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