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DesignCon Set for February
Chicago, IL — The first major event for the electronic design and semiconductor industries in 2008 will be DesignCon, taking place February 4-7, 2008, at the Santa Clara Convention Center in Santa Clara, California.

The 2007 event had record attendance and there were more than 130 exhibiting companies, including the leading providers of EDA tools, test and measurement equipment, PCBs and related technologies, semiconductor components and IP, interconnect technologies, and more.

The IEC's DesignCon 2008 Conference and Exhibition is expected to host thousands of design engineers, award-winning products and industry leaders.

IEC President John Janowiak celebrated the success of the most recent show, saying, "We are very pleased that many of our constituents commended the success of DesignCon 2007. It was well attended, and the conference continues to be extremely popular, as can be measured by the commitment and attendance year after year of the industry's leading professionals and companies."

The February show presented discussions on silicon intellectual property, the future of engineering education, model-based DFM, emerging challenges, 65-nm technology, triple play and

globalization; the DesignVision Awards; and more, DesignCon 2007 drew more than 5,000 people to register and housed more than 300 industry experts who spoke in more than 100 educational tutorials, plenary panels and paper presentations. The upcoming show is expected to be even bigger and better.

For more information, contact: Lisa Reyes 312-559-3325 E-mail: lreyes@iec.org Web: http://www.designcon.com.

 

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