Save. Share. Connect.
Wednesday, March 29, 2017
VOLUME -22 NUMBER 6
Publication Date: 06/1/2007
Front Page News
People in the News
Contract Mfg. Products
Test & Measurement
Product Preview: Atlantic Design/MDM
June 2007 Issue
Add Message Board
Regulated Isolated DC/DC Converters from FDK
San Jose, CA — FDK Corporation has introduced the first regulated products in its Sensei Series of isolated DC/DC converters — the FPQR48T01215 and FPQR48T1214 converters in the industry-standard quarter brick format. Providing up to 180W of output power with minimal derating at elevated temperatures, these converters are designed for Intermediate Bus Architecture (IBA) and Distributed Power Architecture (DPA) in telecommunications, data processing, computing, and storage applications that require a regulated 12V distribution bus.
According to the company, the converters operate from 36VDC to 75VDC and 36VDC to 65VDC input, respectively, and provide a tightly regulated 12VDC output. They deliver up to 15A and 14A, with efficiencies in excess of 91 percent. They are offered in a 2.30 x 1.45-in. (58.4 x 36.8mm) industry-standard quarter brick footprint and pin-out with low body profiles. The FPQR48T01215 converter, with a very low profile of 0.36-in. (9.2mm), is particularly suitable for high density card-rack applications where available clearances can go down to 0.39-in. (10mm).
The converters provide input under-voltage lockout (UVLO), output over-current protection (OCP), output over-voltage protection (OVP), over-temperature protection (OTP), remote output voltage sense, and output voltage trim using industry-standard trim equations. The converters meet the basic insulation requirements of EN60950 and have input-to-output DC isolation of 1500VDC.
The converters deliver full-rated output current, with little or no derating, at high ambient temperatures without the need for heat sinks. With a 48VDC input, the converters provide 15A and 14A of output current in ambient temperatures up to 60°C with 400 LFM (2m/s) airflow. This thermal performance results from electrical, thermal, and packaging design that is optimized for high density circuit card conditions, realized using the manufacturer's advanced circuit and thermal design techniques.
For more information, contact: FDK America, 2270 North First Street, San Jose, CA 95131-2022
408-432-8331 fax: 408-435-7478 Web:
© 2015 USTECH. All Rights Reserved. |
Contact Us: 610-783-6100 | email@example.com
powered by GIM