Save. Share. Connect.
Wednesday, January 17, 2018
VOLUME -22 NUMBER 6
Publication Date: 06/1/2007
Front Page News
People in the News
Contract Mfg. Products
Test & Measurement
Product Preview: Atlantic Design/MDM
June 2007 Issue
Add Message Board
Advanced Interconnections: 500 Position SMT Connectors
High-density B2B connectors.
West Warwick, RI — The B2B High Density SMT Connector line from Advanced Interconnections Corp. is now available in a 500 position footprint on 1.27mm pitch. Designed for high I/O board to board applications where durability and reliability are critical, such as servers and routers, the newest member of the B2B SMT Connector series is available in a standard mated height of 6.00mm and reportedly has low insertion and withdrawal forces.
The B2B SMT Connector line employs screw-machined terminals with multi-finger contacts and the company's exclusive solder ball terminal design — field-proven for superior reliability and processing results. With a current rating of 3 Amps per pin, more contacts can be assigned to data/signal transfer (fewer pins are sacrificed for power/ground).
These high quality terminals, coupled with a precision molded LCP insulator, offer a more rugged and durable contact system that is better suited for blind mating applications. RoHS-compliant Sn/Ag/Cu solder ball terminals are available, along with tape-and-reel packaging for automated pick-and-place.
For more information, contact: Advanced Interconnections Corp., 5 Energy Way, West Warwick, RI 02893
800-424-9850 or 401-823-5200; fax: 401-823-8723 E-mail: email@example.com Web:
© 2015 USTECH. All Rights Reserved. |
Contact Us: 610-783-6100 | firstname.lastname@example.org
powered by GIM