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Monday, October 24, 2016
VOLUME -22 NUMBER 6
Publication Date: 06/1/2007
Front Page News
People in the News
Contract Mfg. Products
Test & Measurement
Product Preview: Atlantic Design/MDM
June 2007 Issue
Test & Measurement
AOI: Getting the Product Right the First Time
By Lyle Sherwood, Sales and Marketing Manager, Landrex Technologies, Inc., Santa Clara, CA
The evaluation of AOI inspection technology falls into two categories: image acquisition and image analysis. Image acquisition comparisons can be simple. Does the AOI system have the ability to acquire images of all of the areas of the PC board assembly where defects might occur? In po ...
Atomic Force Microscopes for Advanced IC Testing
By Brad Rangell, Director of Business Development, Park Systems, Inc., Santa Clara, CA
Semiconductor manufacturers rely on a variety of metrological tools to produce images that help them control processes and identify device failures. However, now that many integrated circuits include three-dimensional interconnects or have layers that are only a few atoms wide, traditi ...
Self-Learning Vision Systems Automatically Adjust Parameters
By Art Gaffin, CEO/CTO, Sightech Vision Systems, Inc., San Jose, CA
Many manufacturers are getting a rude awakening. Their older automated machine vision systems lack the sophisticated processes needed to test today's complex electronic equipment. And while in some parts of the world it is less expensive to use human test inspectors than to invest in v ...
Testing Times for Lead-Free Alloys
By Graham Naisbitt, Managing Director, Gen3 Systems, Farnborough, UK
Removing lead from electronics may be a good idea, but the transition to lead-free solder dramatically changes the electronics assembly procedure, particularly for high-reliability products. Tin/lead solder joints have been comprehensively characterized over many decades, and manufactu ...
X-ray Inspection of Lead-Free Products
By Devonne McPherson, Customer Support Manager, phoenix|x-ray Systems + Services, Inc., St. Petersburg, FL
X-ray inspection of PC boards is most often performed using two dimensional x-ray systems. 2D x-ray inspection systems consist of an x-ray source, detector, and a multi-axis manipulation system for object maneuverability. Images are taken and seen "as is" with little to no calculation ...
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