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Sunday, May 27, 2018
VOLUME -22 NUMBER 6
Publication Date: 06/1/2007
Front Page News
People in the News
Contract Mfg. Products
Test & Measurement
Product Preview: Atlantic Design/MDM
June 2007 Issue
Front Page News
NIST: Tabletop Antenna Calibration to 110GHz
Boulder, CO — The National Institute of Standards and Technology (NIST) has developed a new "tabletop" sized facility to improve characterization of antennas operating in the 60 to 110GHz frequency range. This extended frequency capability serves needs for advanced civilian and military communic ...
Soldier-Testing of Future Combat Systems Clears Design Hurdles
St. Louis, MO — The Boeing Company (NYSE: BA) and Science Applications International Corporation (SAIC) (NYSE: SAI), functioning as the Lead Systems Integrator for the U.S. Army's Future Combat Systems (FCS) program, have successfully completed an eight-month experiment that is a cornerstone of soldier evaluation activities and an important step toward the early infusion of key FCS capabilities to the current force.
Book-to-Bill Shows Small Gain
Bannockburn, IL — The North American rigid PCB industry book-to-bill ratio for March 2007 inched up to 0.99. The North American flexible circuit book-to-bill ratio jumped up to 1.18. The combined (rigid and flex) industry book-to-bill ratio in March 2007 reflected these gains, increasing to 1.00 according ...
Indium Corporation to Feature AuSn Solder Preforms at International Microwave Symposium
CLINTON, NY -
will feature its precision AuSn solder preforms at
International Microwave Symposium
(IMS) 2018 from June 10-15 in Philadelphia, Penn.
Indium Corporation’s AuSn preforms have the highest tensile strength of any solder, ensuring high-reliability for joining and sealing.
SEMICON WEST Adds WT | Wearable Technologies Conference Co-Location: Premier U.S. electronics manufacturing event expands with wearables program
MILPITAS, CA - SEMI, the global industry association representing the electronics manufacturing supply chain, today announced that the WT | Wearable Technologies Conference 2018 USA will co-locate July 11-12 with SEMICON West 2018 in San Francisco.
Flex Power Modules announces new BGA packaging option for digital point-of-load DC/DC converters
Flex Power Modules today announced that its BMR466 and BMR461 digital point-of-load (POL) DC/DC power modules are now available to customers with BGA (Ball Grid Array) packaging, as well as in their original compact LGA (Land Grid Array) package.
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