Wednesday, August 31, 2016
VOLUME -22 NUMBER 6
Publication Date: 06/1/2007
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ARCHIVE >  June 2007 Issue >  Front Page News > 
NIST: Tabletop Antenna Calibration to 110GHz

Boulder, CO — The National Institute of Standards and Technology (NIST) has developed a new "tabletop" sized facility to improve characterization of antennas operating in the 60 to 110GHz frequency range. This extended frequency capability serves needs for advanced civilian and military communic ...

Soldier-Testing of Future Combat Systems Clears Design Hurdles

St. Louis, MO — The Boeing Company (NYSE: BA) and Science Applications International Corporation (SAIC) (NYSE: SAI), functioning as the Lead Systems Integrator for the U.S. Army's Future Combat Systems (FCS) program, have successfully completed an eight-month experiment that is a cornerstone of soldier evaluation activities and an important step toward the early infusion of key FCS capabilities to the current force.

Book-to-Bill Shows Small Gain

Bannockburn, IL — The North American rigid PCB industry book-to-bill ratio for March 2007 inched up to 0.99. The North American flexible circuit book-to-bill ratio jumped up to 1.18. The combined (rigid and flex) industry book-to-bill ratio in March 2007 reflected these gains, increasing to 1.00 according ...


 
 
Industry Veteran Lung Chu Named President of SEMI China
SAN JOSE, CA - SEMI today announced the appointment of Lung Chu as president of SEMI China effective September 1, 2016. With the recent broadening ambitions for China’s indigenous semiconductor supply chain, Lung Chu joins SEMI at a critical inflection in the China market. Chu will be instrumental in evolving and repositioning SEMI’s programs, committees, products and services in China to deliver the highest member value in the rapidly changing China semiconductor ecosystem.

IPC Releases Annual Electronics Assembly Industry Quality Benchmark Study
BANNOCKBURN, IL - IPC's Study of Quality Benchmarks for Electronics Assembly 2016 is now available. The annual study provides valuable benchmarking data to electronics assembly companies interested in comparing quality measurements to industry averages.

The quality control measurements covered by the study include first-pass yields for various test methods in use as well as the percent of products subjected to these tests.

Alpha to Feature Material Set Combinations for Greatest Reliability at SMTA Guadalajara Expo
SOMERSET, NJ - Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will feature material set combinations to include paste, tacky flux, cored wire and wave soldering flux that are tested with one another to achieve greater reliability at the SMTA Guadalajara Expo to be held October 5th-6th in Guadalajara, Jal. MÉXICO.

Indium Corporation Experts to Present at IEMT–EMAP 2016
CLINTON, NY - Indium Corporation experts will deliver several technical presentations at the 37th International Electronics Manufacturing Technology and 18th Electronics Material & Packaging Conference (IEMT-EMAP 2016), Sept. 20-22, in Penang, Malaysia.

Andy C. Mackie, PhD, MSc, Senior Product Manager for Semiconductor and Advanced Assembly Materials, will deliver the keynote address, The Future of Power Device Packaging: Materials and Assembly Processes.

 
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