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LPKF Intros UV Laser for Flex Circuit Processing
UV laser system.
Wilsonville, OR — The new LPKF MicroLine UV 3000 is a compact laser system designed to cut precise openings in polyimide coverlayer foils and to cut flex circuits, providing flexibility, reliability, and high precision. The laser reduces product changeover time, making it an efficient component to any fabrication process. This system represents the next generation in LPKF lasers by addressing critical applications in prototyping and pre-series production.

The MicroLine UV 3000 laser cutting system raised the bar with a new high speed linear drive for flexible circuits, featuring greater positioning accuracy, higher speed, and faster acceleration — resulting in reduced processing times. The MicroLine UV 3000 laser system is fast and encompasses versatile tools with the ability to perform precision cutting, routing, skiving, drilling, cutting pockets, structuring of etch/solder resist, and micromachining of ceramic substrates. According to the company, these capabilities noticeably reduce changeover time, making it an efficient component of any fabrication process, especially where physical space is at a premium.

For more information, contact: LPKF Laser & Electronics, P.O. Box 3858, Wilsonville, OR 97070 503-454-4202 fax: 503-682-7151 E- mail: info@lpkfusa.com Web: http://www.lpkfusa.com

 

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