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S.E.C. Upgrades Model 860 Bonder
Upgraded bonder.
Moorpark, CA — Semiconductor Equipment Corp. has upgraded its Model 860 Omni Bonder to the new Model 860 Eagle Bonder. According to the company, this is already a well-established tool for R&D and low volume production in the optoelectronics, hybrid MEMS, and medical device markets. Now the tool has been enhanced even further for applications including solder and gold bumped flip chip, eutectic bonding, thermosonic, and epoxy bonding.

New features include LED lighting for the viewer, CCD digital camera with enhanced resolution and magnification, 17-in. flat panel LCD color display, precision servo-driven Z motion with closed loop bond load control, real time graphic display of closed loop temperature controls for head, stage and spot heating. All new control software using Windows XP Pro operating system. The table is also new, with vibration isolation and a smaller footprint, but with a larger work area and more leg room.

For more information, contact: Semiconductor Equipment Corp., P.O. Box 8079, Moorpark, CA 93020-8079. 805-529-2293 fax: 805-529-2193. Web: http://www.semicorp.com

 

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