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Autosplice: Right-Angle Interconnects
Right angle connectors.
San Diego, CA — Autosplice has introduced a line of right- angle interconnects that are both solderless press fits that provide low-profile right-angle connector design. This new series of Autoheader interconnects provides an appropriate solution for solder-free, lead-free assembly applications that involve restricted clearance, such as stacked PC boards, junction box (J-Box) assemblies, or automotive connector modules and switches.

The new right-angle interconnects use the proven eye-of-the-needle AutoPliant™ compliant technology, which has already undergone extensive qualification testing for use in automotive applications, where the rugged environmental requirements place stringent demands on solderless type interconnections to consistently maintain optimal retention force, and high current-carrying capacity.

Key test parameters include thermal shock, mechanical shock and vibration, and temperature and humidity cycling, using test criteria based on the SAE/USCAR2 Revision 4, and IEC 60352-5 standards. The company's compliant interconnects were shown to significantly exceed retention force requirements, and were proven to maintain a consistent gas-tight fit under adverse conditions, which is critical in avoiding degradation of electrical continuity while assuring long-term mechanical integrity of the assembly.

The interconnects are available in a variety of pin-header configurations to meet specific assembly requirements, including industry-standard 0.64 x 0.64mm square pins on 2.5mm pitch spacing. Both single-row and dual-row formats are available to provide flexibility for higher interconnect densities.

The new interconnects offer all of the benefits of solderless, press-fit assembly — automation-friendly, elimination of inefficient secondary processing, gas-tight connections, high level of in-board retention force, excellent current-carrying

capabilities, and compliance with RoHS lead-free requirements — along with the additional advantage of providing the low-profile form factor needed to move solderless assembly into tight, space-constrained assembly applications.

For more information, contact: Autosplice, Inc., 10121 Barnes Canyon Rd., San Diego, CA 92121 800-535-5538 or 858-535-0077 fax: 858-535-0130 E-mail: connect@autosplice.com Web: http://www.autosplice.com

 

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