Thursday, July 28, 2016
VOLUME -22 NUMBER 5
Publication Date: 05/1/2007
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ARCHIVE >  May 2007 Issue >  Front Page News > 
Researchers Bend Nanowires, Create New Components


Atlanta, GA — Researchers have taken advantage of the unique coupled semiconducting and piezoelectric properties of zinc oxide nanowires to create a new class of electronic components and devices that could provide the foundation...

Container Ports Get RFID Tracking Security

Charleston, SC and Mountain View, CA — The South Carolina State Ports Authority (SCSPA) and Savi Networks have agreed to extend the SaviTrak information service to three container terminals at the Port of Charleston to enhance the security and efficiency of in-transit cargo shipments.
February Book-to-Bill In Upswing

Bannockburn, IL — The North American rigid PCB industry book- to-bill ratio for February 2007 climbed to 0.96, while the North American flexible circuit book-to-bill ratio increased to 0. ...


 
 
Registration Open with New Exhibition Features at SEMICON Europa
GRENOBLE, FRANCE - Today SEMI announced registration opened for Europe’s largest electronics manufacturing exhibition, SEMICON Europa (25-26 October) in Grenoble. Featuring over 100 hours of technical sessions and presentations, SEMICON Europa includes semiconductor equipment and materials as well as additional topics, such as Imaging, Power Electronics, and Advanced Packaging.
SMTA and IPC: Cleaning and Conformal Coating Conference Program Finalized
MINNEAPOLIS, MN - The SMTA and IPC are pleased to announce the program for the 2016 Cleaning and Conformal Coating Conference being held October 25-27, 2016 in Rosemont, IL.

Two tutorials will be held on Tuesday, October 25th. Dale Lee, Plexus Corporation, will instruct “Design for Excellence: Focus on DfR-Design for Reliability of Hardware to be Cleaned” on Tuesday morning. After lunch, Doug Pauls, Rockwell Collins and Jason Keeping, P.Eng., Celestica, Inc. will co-instruct a course on “Robust Coating Processes in the Factory: Methods, Critical Parameters, Problems and Remedies.”

Viribright Lighting Announces US Patent Award for LED Packaging Design
CORONA, CA - Viribright Lighting, Inc., a global leader in LED lighting manufacturing, announced today that is has received a US Patent (US 9,379,300) for the design of an LED chip welded in a flip-chip manner on a floating copper heat radiation support. The Viribright LED packaging design generates more lumens per watt with better control of heat dissipation than previous LED manufacturing methods.

 
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