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Friday, May 25, 2018
VOLUME -22 NUMBER 5
Publication Date: 05/1/2007
Front Page News
People in the News
Contract Mfg. Products
Special Feature: Components & Disty
Product Preview: Electronics Distribution Show (EDS)
May 2007 Issue
Front Page News
Researchers Bend Nanowires, Create New Components
By John Toon
Atlanta, GA — Researchers have taken advantage of the unique coupled semiconducting and piezoelectric properties of zinc oxide nanowires to create a new class of electronic components and devices that could provide the foundation...
Container Ports Get RFID Tracking Security
Charleston, SC and Mountain View, CA — The South Carolina State Ports Authority (SCSPA) and Savi Networks have agreed to extend the SaviTrak
information service to three container terminals at the Port of Charleston to enhance the security and efficiency of in-transit cargo shipments.
February Book-to-Bill In Upswing
Bannockburn, IL — The North American rigid PCB industry book- to-bill ratio for February 2007 climbed to 0.96, while the North American flexible circuit book-to-bill ratio increased to 0. ...
Indium Corporation to Feature AuSn Solder Preforms at International Microwave Symposium
CLINTON, NY -
will feature its precision AuSn solder preforms at
International Microwave Symposium
(IMS) 2018 from June 10-15 in Philadelphia, Penn.
Indium Corporation’s AuSn preforms have the highest tensile strength of any solder, ensuring high-reliability for joining and sealing.
SEMICON WEST Adds WT | Wearable Technologies Conference Co-Location: Premier U.S. electronics manufacturing event expands with wearables program
MILPITAS, CA - SEMI, the global industry association representing the electronics manufacturing supply chain, today announced that the WT | Wearable Technologies Conference 2018 USA will co-locate July 11-12 with SEMICON West 2018 in San Francisco.
Flex Power Modules announces new BGA packaging option for digital point-of-load DC/DC converters
Flex Power Modules today announced that its BMR466 and BMR461 digital point-of-load (POL) DC/DC power modules are now available to customers with BGA (Ball Grid Array) packaging, as well as in their original compact LGA (Land Grid Array) package.
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