Tuesday, August 30, 2016
VOLUME -22 NUMBER 5
Publication Date: 05/1/2007
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ARCHIVE >  May 2007 Issue >  Front Page News > 
Researchers Bend Nanowires, Create New Components


Atlanta, GA — Researchers have taken advantage of the unique coupled semiconducting and piezoelectric properties of zinc oxide nanowires to create a new class of electronic components and devices that could provide the foundation...

Container Ports Get RFID Tracking Security

Charleston, SC and Mountain View, CA — The South Carolina State Ports Authority (SCSPA) and Savi Networks have agreed to extend the SaviTrak information service to three container terminals at the Port of Charleston to enhance the security and efficiency of in-transit cargo shipments.
February Book-to-Bill In Upswing

Bannockburn, IL — The North American rigid PCB industry book- to-bill ratio for February 2007 climbed to 0.96, while the North American flexible circuit book-to-bill ratio increased to 0. ...


 
 
Industry Veteran Lung Chu Named President of SEMI China
SAN JOSE, CA - SEMI today announced the appointment of Lung Chu as president of SEMI China effective September 1, 2016. With the recent broadening ambitions for China’s indigenous semiconductor supply chain, Lung Chu joins SEMI at a critical inflection in the China market. Chu will be instrumental in evolving and repositioning SEMI’s programs, committees, products and services in China to deliver the highest member value in the rapidly changing China semiconductor ecosystem.

Alpha to Feature Material Set Combinations for Greatest Reliability at SMTA Guadalajara Expo
SOMERSET, NJ - Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will feature material set combinations to include paste, tacky flux, cored wire and wave soldering flux that are tested with one another to achieve greater reliability at the SMTA Guadalajara Expo to be held October 5th-6th in Guadalajara, Jal. MÉXICO.

Indium Corporation Experts to Present at IEMT–EMAP 2016
CLINTON, NY - Indium Corporation experts will deliver several technical presentations at the 37th International Electronics Manufacturing Technology and 18th Electronics Material & Packaging Conference (IEMT-EMAP 2016), Sept. 20-22, in Penang, Malaysia.

Andy C. Mackie, PhD, MSc, Senior Product Manager for Semiconductor and Advanced Assembly Materials, will deliver the keynote address, The Future of Power Device Packaging: Materials and Assembly Processes.

 
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