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Saturday, December 16, 2017
VOLUME -22 NUMBER 5
Publication Date: 05/1/2007
Front Page News
People in the News
Contract Mfg. Products
Special Feature: Components & Disty
Product Preview: Electronics Distribution Show (EDS)
May 2007 Issue
Front Page News
Researchers Bend Nanowires, Create New Components
By John Toon
Atlanta, GA — Researchers have taken advantage of the unique coupled semiconducting and piezoelectric properties of zinc oxide nanowires to create a new class of electronic components and devices that could provide the foundation...
Container Ports Get RFID Tracking Security
Charleston, SC and Mountain View, CA — The South Carolina State Ports Authority (SCSPA) and Savi Networks have agreed to extend the SaviTrak
information service to three container terminals at the Port of Charleston to enhance the security and efficiency of in-transit cargo shipments.
February Book-to-Bill In Upswing
Bannockburn, IL — The North American rigid PCB industry book- to-bill ratio for February 2007 climbed to 0.96, while the North American flexible circuit book-to-bill ratio increased to 0. ...
SEMI: North American Semiconductor Equipment Industry Posts November 2017 Billings
MILPITAS, CA - North America-based manufacturers of semiconductor equipment posted $2.05 billion in billings worldwide in November 2017 (three-month average basis), according to the November
Equipment Market Data Subscription
(EMDS) Billings Report published today by SEMI.
Avnet Sponsors The Not Impossible Awards Recognizing Emerging Technologies that Improve Lives
Avnet, a leading global technology distributor, today announced its title sponsorship of The Not Impossible Awards, which recognizes the breakthrough achievements of innovators who share the Not Impossible Labs mission to create inventive technology that improves the well-being of others.
aveni® S.A. Extends Copper Interconnects to 5nm and Below for BEOL Integration Using Innovative Electroplating Chemistry
MASSY, France - aveni S.A., developer and manufacturer of market-disrupting wet deposition technologies and chemistries for 2D interconnects and 3D through silicon via packaging, today announced it has obtained results that strongly support the continued use of copper in the back end of line (BEOL) for advanced interconnects, at and beyond the 5nm technology node.
Kilopass NVM OTP IP Achieves 3-Lot Qualification on GLOBALFOUNDRIES 14nm LPP (Low Power Process) Process Technology
SAN JOSE, CA - Kilopass Technology Inc., a leading provider of semiconductor logic embedded non-volatile memory (eNVM) intellectual property (IP), today announced that it successfully achieved a three-lot qualification on GLOBALFOUNDRIES (GF) 14nm LPP (Low Power Process) technology platform for its one-time programmable (OTP) NVM technology.
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